Texas Instruments' New PicoStar - world's thinnest package for portable consumer electronics
Portable consumer electronics designers can save board space with integrated circuits (ICs) in the PicoStar package that Texas Instruments Incorporated (TI) introduced Thursday. The ultra-thin package, about as thin as a human hair, is the first to give system designers the option to embed silicon components inside the printed circuit board (PCB) to maximize board space. Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipment. The TPD2E007, a two-channel, robust electrostatic discharge (ESD) solution, is the first device available in the ultra-thin PicoStar package.
The TPD2E007 is a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Typically, ESD protection is mounted close to the connector on the PCB, but designers have the option to surface mount or embed the TPD2E007 into the board/connector. The ability to embed this ultra-thin device in the board allows designers to save 80 percent board space compared to typical ESD solutions.
Key features of the TPD2E007
- Robust ESD protection: o ±8-kV IEC 61000-4-2 contact discharge/o ±15-kV IEC 61000-4-2 air-gap discharge
- Back-to-back diode configuration for negative signal swing
- 15-pF line to ground capacitance
- Low 50-nA leakage current
- PicoStar package: 0.15 mm package height
- Reduces board space, which gives end equipment designers the option to add more components on the board
- Thin form factor allows the device to be inserted into a board layer stack-up with minimal effort
- Board-level cost can be reduced by embedding the device in the PCB
Availability and pricing
The TPD2E007 is available in a 4-pin YFM package and is priced at $0.20 in quantities of 1,000. Additional TI devices will be developed in PicoStar packaging, such as the TPS62620 low-power DC/DC converter, which is sampling now and will be available in volume production in 3Q of 2009.