Samsung developed 32GB DDR3 Memory Module for low-power server operations
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that it has developed the world's first 32 GB DDR3 memory module - for use in low-power server systems. The new module operates at 1.35-volts, in support of the global trend to cut power usage in mass storage computing environments. The new memory module comes as a green solution for some of the upcoming high-end products that are expected to provide business users with higher levels of performance.
"Compared to the 8GB memory modules used in today's servers, our new module packs an eco-sensitive wallop with four times the density at significantly reduced power levels and no increase in the overall footprint," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc. "For data centers, it's a powerhouse in energy efficiency and performance," he added.
According to Samsung, the new 32GB memory module has been designed using the company's 50nm-class 4GB DDR3, providing costumers with an operating voltage of 1.35V, which improves throughput by 20 percent over a 1.5V DDR3. In addition, according to Samsung, the new memory module delivers new levels of energy efficiency, making them suitable for some of the more energy-efficient "green" systems.
The new 32GB registered dual inline memory module (RDIMM) consists of 72 4Gb DDR3 chip dies produced using Samsung's 50nm class DRAM production technology. A row of nine quad-die package (QDP) 16Gb DDR3s are mounted on each side of the printed circuit board for a collective 32GB, highly compact configuration.
According to the International Data Corporation (IDC), a market research and analysis firm, the worldwide DDR3 DRAM market will account for 29 percent of the total DRAM market in 2009 and 75 percent in 2011. In addition, IDC estimates that 2Gb-or-higher DDR3 DRAM will make up three percent of the total DRAM market in 2009 and 33 percent in 2011 (units in bits).