VIA Embedded to revolutionize Digital Signage Markets
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, announced it will showcase a forthcoming, digital signage solution for multi screen HD content at East Wing of Embedded Systems Expo (ESEC), which will be held in Tokyo, Japan from May 13-15.
Visitors to ESEC 2009 will see a platform that features dual HDMI connectors and an onboard DX10.1 capable graphics processor from S3 Graphics. Powering up to four digital displays of glorious HD content, the latest Mini-ITX board from VIA eliminates the need for an additional graphics card, offering an affordable solution that can be brought to market faster, without requiring expensive and time consuming software customization.
"Our digital signage solution represents a new approach to HD content delivery, both in terms of ROI and speed to market," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "VIA's long term strategy is to re-invigorate existing markets with innovative products and services that continue to give our customers the edge in a competitive market place."
VIA will also showcase products using the latest VIA developed Em-ITX and Pico-ITXe form factors. The VIA EITX-3000 board takes advantage of the latest Em-ITX form factor specification, adding longer dual I/O coastlines to provide ample space for a wide array of I/O options. Designed for ultra-thin embedded applications, the VIA EITX-3000 can withstand a wide range of temperatures and features a 1.3GHz VIA Nano processor. Visitors to ESEC 2009 will also be able to see the first Pico-ITXe based product on the market, the VIA EPIA-P710. Using SUMIT connectors to mount customized expansion boards in a stackable, I/O-centric implementation, the VIA EPIA-P710 is perfect for a wide range of small form factor embedded applications.